Semiconductor fabrication method and system

Details Semiconductor fabrication method and system Semiconductor fabrication method and system

2011-06-28

2011-06-28

Thai, Luan C (Department: 2891)

Active solid-state devices (e.g., transistors, solid-state diode

Responsive to non-electrical signal

Electromagnetic or particle radiation

C257S431000, C257S432000, C257S434000, C257S774000, C257SE31127

Reexamination Certificate

active

07968962

ABSTRACT:
A semiconductor device is disclosed. In one embodiment, a device includes a substrate having one or more vias and a carrier coupled to the substrate to form a sealed cavity between the carrier and the substrate. In some embodiments, the sealed cavity may be pressurized. The device may also include a redistribution layer formed over the one or more vias on a side of the substrate. Other devices, systems, and methods are also disclosed.

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patent: 2009/0014869 (2009-01-01), Vrtis et al.

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