Semiconductor fabrication apparatus having FOUP index in...

Details Semiconductor fabrication apparatus having FOUP index in... Semiconductor fabrication apparatus having FOUP index in...

2006-07-04

2006-07-04

Keenan, James W. (Department: 3652)

Material or article handling

Apparatus for moving material between zones having different...

For carrying standarized mechanical interface type

C414S937000, C414S939000

Reexamination Certificate

active

07070379

ABSTRACT:
A semiconductor fabrication apparatus, located in an apparatus installation area, includes a front-opening unified pod (FOUP) index, a plate, a first transfer device, a second transfer device, and an engineering FOUP index and multiple processing chambers. The FOUP index can be located in a line, vertically, horizontally, on top, and on bottom. The engineering FOUP index is used for manually locating the FOUP thereon in case of processing irregular single wafers that are not stored in a lot. As the FOUP index is located in the semiconductor fabrication apparatus installed in the apparatus installation area, dead space between the apparatus and air eddies generated above and below the FOUP index can be eliminated to increase the efficiency of working area and improve the environment in fabrication.

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