Optics: measuring and testing – By light interference – For dimensional measurement
Reexamination Certificate
2005-12-06
2005-12-06
Lee, Hwa (Andrew) (Department: 2877)
Optics: measuring and testing
By light interference
For dimensional measurement
C438S016000
Reexamination Certificate
active
06972848
ABSTRACT:
When a semiconductor wafer placed in a chamber and having films thereon is etched using plasma generated in the chamber, a change in the amount of lights with at least two wavelengths, obtained from the wafer surface during the processing, is detected. The time between the time at which the amount of a light with one of two wavelengths is maximized and the time at which the amount of a light with the other wavelength is minimized is compared with a predetermined value to determine the state of etching processing.
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Jyouo Kazuhiro
Ono Tetsuo
Usui Tatehito
Yoshigai Motohiko
Antonelli, Terry Stout and Kraus, LLP.
Hitach High-Technologies Corporation
Lee Hwa (Andrew)
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