Adhesive bonding and miscellaneous chemical manufacture – Differential fluid etching apparatus – With microwave gas energizing means
Patent
1985-09-18
1986-12-30
Powell, William A.
Adhesive bonding and miscellaneous chemical manufacture
Differential fluid etching apparatus
With microwave gas energizing means
156643, 156646, 204298, B44C 122, C03C 1500, H01L 21306, C23F 102
Patent
active
046327193
ABSTRACT:
In an apparatus for etching a large semiconductor wafer the etch rate and uniformity of etching at the edges is improved by using an array of magnets behind the collector plate to form a double ring of plasma and using a grounded shield ring with perforations to pass gases. The shield ring extends both above and below the surface of the wafer being etched.
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"High Rate Reactive Ion Etching Using a Magnetron Discharge", Haruo Okano et al, Solid State Technology, Apr. 1982, pp. 166 et seq.
Chow Robert
Downey Steven D.
Cole Stanley Z.
Powell William A.
Varian Associates Inc.
Warsh Kenneth L.
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