Semiconductor encapsulating flame retardant epoxy resin...

Details Semiconductor encapsulating flame retardant epoxy resin... Semiconductor encapsulating flame retardant epoxy resin...

2006-10-17

2006-10-17

Sellers, Robert (Department: 1712)

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Processes of preparing a desired or intentional composition...

C257S789000, C257S793000, C523S458000

Reexamination Certificate

active

07122587

ABSTRACT:
A flame retardant epoxy resin composition for semiconductor encapsulation includes as essential components, (A) an epoxy resin, (B) a curing agent, (C) an inorganic filler, and (D) a phosphazene compound of the average compositional formula (1) having a melting point of 110–130° C.,wherein a, b and n are numbers satisfying 0<a≦0.05n, 1.90n≦b<2n, 2a+b=2n, and 3≦n≦6, the composition being substantially free of bromides and antimony compounds.

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