Semiconductor encapsulating epoxy resin compositions with 2-phen

Details Semiconductor encapsulating epoxy resin compositions with 2-phen Semiconductor encapsulating epoxy resin compositions with 2-phen

1995-12-01

1998-03-24

Wilson, Donald R.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Processes of preparing a desired or intentional composition...

525481, 528 98, 528104, 528117, C08L 6108, C08L 6304, C08G 5956

Patent

active

057313709

ABSTRACT:
A epoxy resin composition comprising (A) an epoxy resin bearing at least one monovalent hydrocarbon group on a benzene ring, (B) a phenolic resin, (C) an inorganic filler, and (D) 2-phenyl-4,5-dihydroxymethylimidazole as a curing accelerator has a low melt viscosity, a long gel time and a high curing rate, and provides cured products having improved properties. Semiconductor devices encapsulated with cured products of the inventive composition are reliable.

REFERENCES:
patent: 4859722 (1989-08-01), Shiobara et al.
patent: 4942190 (1990-07-01), Murayama et al.
patent: 5001174 (1991-03-01), Yanagisawa et al.
patent: 5248710 (1993-09-01), Shiobara et al.
patent: 5346743 (1994-09-01), Uchida et al.

Affiliated with

Also associated with

Rating

Semiconductor encapsulating epoxy resin compositions with 2-phen does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor encapsulating epoxy resin compositions with 2-phen, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor encapsulating epoxy resin compositions with 2-phen will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2289478