Semiconductor encapsulating epoxy resin compositions and semicon

Details Semiconductor encapsulating epoxy resin compositions and semicon Semiconductor encapsulating epoxy resin compositions and semicon

1990-02-27

1992-03-17

Thomas, Alexander S.

Stock material or miscellaneous articles

Sheet including cover or casing

Complete cover or casing

523435, 523440, 523457, 357 72, B32B 2738, B32B 100, C08K 322

Patent

active

050967622

ABSTRACT:
An epoxy resin composition comprising an epoxy resin, a curing agent, a substantially pure alpha-alumina filler, and a silicone-modified epoxy or phenol resin is useful in encapsulating semiconductor devices. The composition can be molded and cured into a product having improved thermal conductivity and moisture resistance.

REFERENCES:
patent: 4248920 (1981-02-01), Yoshizumi et al.
patent: 4650819 (1987-03-01), Nakamoto et al.
patent: 4720515 (1988-01-01), Iji et al.
patent: 4923912 (1990-05-01), Sasaki et al.

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