Stock material or miscellaneous articles – All metal or with adjacent metals – Composite; i.e. – plural – adjacent – spatially distinct metal...
Patent
1998-12-30
2000-10-31
Dawson, Robert
Stock material or miscellaneous articles
All metal or with adjacent metals
Composite; i.e., plural, adjacent, spatially distinct metal...
523451, 525500, 525523, 528 89, H01L 2912
Patent
active
061399787
ABSTRACT:
Epoxy resin compositions comprising (A) a polyfunctional epoxy resin, (B) a polyfunctional phenolic resin curing agent, (C) an organophosphorus curing accelerator, (D) an aminosilane coupling agent, and (E) an inorganic filler have excellent flow properties, shelf stability and curing speed and are thus suitable for semiconductor encapsulation, especially BGA encapsulation. Semiconductor devices encapsulated with the epoxy resin compositions are highly reliable.
REFERENCES:
patent: 4572853 (1986-02-01), Ikeya et al.
Wells, Semiconductor International, pp. 214-218 (May 1989).
Nikkei Microdevices, pp. 66-67 (Jul. 1987) (no translation is currently available).
Arai Kazuhiro
Shiobara Toshio
Tomiyoshi Kazutoshi
Aylward D.
Dawson Robert
Shin-Etsu Chemical Co. , Ltd.
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