Semiconductor encapsulating epoxy resin compositions, and semico

Stock material or miscellaneous articles – All metal or with adjacent metals – Composite; i.e. – plural – adjacent – spatially distinct metal...

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523451, 525500, 525523, 528 89, H01L 2912

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active

061399787

ABSTRACT:
Epoxy resin compositions comprising (A) a polyfunctional epoxy resin, (B) a polyfunctional phenolic resin curing agent, (C) an organophosphorus curing accelerator, (D) an aminosilane coupling agent, and (E) an inorganic filler have excellent flow properties, shelf stability and curing speed and are thus suitable for semiconductor encapsulation, especially BGA encapsulation. Semiconductor devices encapsulated with the epoxy resin compositions are highly reliable.

REFERENCES:
patent: 4572853 (1986-02-01), Ikeya et al.
Wells, Semiconductor International, pp. 214-218 (May 1989).
Nikkei Microdevices, pp. 66-67 (Jul. 1987) (no translation is currently available).

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