Semiconductor encapsulating epoxy resin compositions

Details Semiconductor encapsulating epoxy resin compositions Semiconductor encapsulating epoxy resin compositions

1990-02-08

1992-08-11

Michl, Paul R.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Processes of preparing a desired or intentional composition...

523223, 523443, C08K 708

Patent

active

051379406

ABSTRACT:
A semiconductor encapsulating epoxy resin composition comprising an epoxy resin, a curing agent, and an inorganic filler is improved in melt flow and moldability when the filler comprises spherical silica having a mean particle size of 5 to 35 .mu.m and a specific surface area of up to 1.4 m.sup.2 /g. A mixture of (A) spherical silica having a mean particle size of 0.1 to 2 .mu.m, and (C) ground silica having a mean particle size of 2 to 15 .mu.m is also useful as the filler. A cured product thereof has a low coefficient of expansion and improved crack resistance upon soldering after moisture absorption.

REFERENCES:
patent: 4617330 (1986-10-01), Thai et al.
patent: 4701479 (1987-10-01), Shiobara et al.

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