Semiconductor encapsulating epoxy resin composition and semicond

Details Semiconductor encapsulating epoxy resin composition and semicond Semiconductor encapsulating epoxy resin composition and semicond

1998-11-10

2000-12-12

Dawson, Robert

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

From phenol, phenol ether, or inorganic phenolate

523451, 525481, 525489, 525524, 528103, C08G 5908

Patent

active

061600784

ABSTRACT:
An epoxy resin composition comprising an epoxy resin of a specific structure, a phenolic resin of a specific structure, and an inorganic filler is suited for semiconductor encapsulation since it is effectively moldable and cures into products having improved flame retardance, reflow crack resistance and dielectric properties.

REFERENCES:
patent: 3632555 (1972-01-01), Harris et al.
patent: 5418266 (1995-05-01), Shiobara et al.
English Abstract of Japan 158475.
English Abstract of Japan 204257.

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