Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – Processes of preparing a desired or intentional composition...
Reexamination Certificate
2005-05-17
2005-05-17
Moore, Margaret G. (Department: 1712)
Synthetic resins or natural rubbers -- part of the class 520 ser
Synthetic resins
Processes of preparing a desired or intentional composition...
C523S458000, C528S087000, C528S099000, C528S210000, C528S405000, C528S418000, C528S420000, C528S423000
Reexamination Certificate
active
06894091
ABSTRACT:
A semiconductor encapsulating epoxy resin composition comprising (A) an epoxy resin, (B) a phenolic resin curing agent, (C) a molybdenum compound, and (D) 300-900 parts by weight per 100 parts by weight of components (A) and (B) combined of an inorganic filler contains nitrogen atoms in an amount of 1.5-20% by weight based on the weight of components (A) and (B) combined. Cured parts of the composition exhibit high-temperature capabilities and flame retardance despite the absence of halogenated epoxy resins and antimony trioxide.
REFERENCES:
patent: 6190787 (2001-02-01), Maeda et al.
patent: 6214455 (2001-04-01), Honda et al.
patent: 10324791 (1998-12-01), None
Aoki Takayuki
Asano Eiichi
Ino Shigeki
Osada Shoichi
Shiobara Toshio
Birch Stewart Kolasch & Birch, LLP.
Moore Margaret G.
Shin - Etsu Chemical Co. Ltd.
Zimmer Marc S.
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