Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – Mixing of two or more solid polymers; mixing of solid...
Reexamination Certificate
2006-07-21
2009-10-20
Sellers, Robert (Department: 1796)
Synthetic resins or natural rubbers -- part of the class 520 ser
Synthetic resins
Mixing of two or more solid polymers; mixing of solid...
C257S793000, C523S457000, C523S458000, C523S466000
Reexamination Certificate
active
07605213
ABSTRACT:
There is provided an epoxy resin composition for encapsulating a semiconductor essentially comprising (A) a phenolaralkyl type epoxy resin having a phenylene structure, (B) a phenolaralkyl resin having a biphenylene structure, (C) a curing accelerator containing an adduct of a phosphine compound and a quinone compound, (D) a compound in which hydroxyl groups are attached to each of two or more adjacent carbon atoms of an aromatic ring, (E) a silane coupling agent and (F) an inorganic filler, wherein the inorganic filler (F) is contained in 84 wt % to 92 wt % both inclusive in the total amount of the epoxy resin composition.
REFERENCES:
patent: 7023098 (2006-04-01), Umeno et al.
patent: 2006/0094797 (2006-05-01), Murotani et al.
patent: 01-275618 (1989-11-01), None
patent: 05-097965 (1993-04-01), None
patent: 05-097967 (1993-04-01), None
patent: 2003-212958 (2003-07-01), None
patent: 2003-212958 (2003-07-01), None
patent: 2004-035781 (2004-02-01), None
patent: 2004-35781 (2004-02-01), None
patent: 2006-111672 (2006-04-01), None
Sellers Robert
Smith , Gambrell & Russell, LLP
Sumitomo Bakelite Co. Ltd.
LandOfFree
Semiconductor encapsulant of epoxy resin, phenolic resin,... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Semiconductor encapsulant of epoxy resin, phenolic resin,..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor encapsulant of epoxy resin, phenolic resin,... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4099493