Semiconductor element with disk-shaped housing

Details Semiconductor element with disk-shaped housing Semiconductor element with disk-shaped housing

1984-03-06

1986-08-19

Davie, James W.

Electricity: conductors and insulators

Feedthrough or bushing

Compression

357 74, 174 52P, H02G 1308, H01L 2332

Patent

active

046072756

ABSTRACT:
A disk-shaped housing for a semiconductor element comprising a cup (1) of insulating material with an opening (2) at the bottom. Through this opening (2) passes a contact surface (4) of one of two plate type connecting bodies (3), between which lies a pressure-contacted semiconductor body (14). Both connecting bodies (3, 5) comprise radially and axially oriented seal surfaces (8, 9; 11, 12), against which there abuts under pressure an elastic ring (13) which surrounds the semiconductor body. The cup is filled with sealing compound (18); the semiconductor body is thus protected against penetration of the sealing compound.

REFERENCES:
patent: 3558999 (1971-01-01), Palies
patent: 3688163 (1972-08-01), Daniels et al.
patent: 4274106 (1981-06-01), Ohdate
patent: 4399452 (1983-08-01), Nakashima et al.

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