Semiconductor element string structure

Details Semiconductor element string structure Semiconductor element string structure

1989-02-23

1990-12-18

James, Andrew J.

357 68, H01L 2348

Patent

active

049790170

ABSTRACT:
A semiconductor element string having a number of semiconductor elements mounted on a lead frame. The lead frame has a transverse plate, an assembling plate and a number of first and second leads respectively connected to the transverse plate and the assembling plate. The lead frame is used to form the semiconductor element string by soldering the semiconductor elements on the end portions of the first and second leads. When forming the semiconductor element string, one of the leads of each of the semiconductor elements in the string is connected to the transverse plate.

REFERENCES:
patent: 3558994 (1971-01-01), Bernstein
patent: 3606673 (1971-09-01), Overman
patent: 3660669 (1972-05-01), Grenon
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patent: 3914786 (1975-10-01), Grossi
patent: 3916433 (1975-10-01), Schierz
patent: 4152624 (1979-05-01), Knaebel
patent: 4532538 (1985-07-01), Wurz
patent: 4616250 (1986-10-01), Folk
patent: 4633582 (1987-01-01), Ching et al.

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