Semiconductor element string structure

Details Semiconductor element string structure Semiconductor element string structure

1990-07-27

1991-01-08

James, Andrew J.

357 70, 357 65, H01L 2348

Patent

active

049840576

ABSTRACT:
A semiconductor element string having a number of semiconductor elements, each of which has the first and second leads mounted on a transverse plate. The first leads are cut off from the transverse plate, when the semiconductor element string is to be mounted on the printed circuit board. The second leads connected to the transverse plate serve as the ground lines for the respective semiconductor elements by bending two distal ends of the transverse plate to be mounted on the printed circuit board. A linking piece is provided crossing over the middle portions of the first and second leads so as to make the whole construction more stable. The second leads are bent into a S-shaped structure. Each second lead and its corresponding first lead are located on a first vertical plane which intersects with a second vertical plane passing through a common longitudinal axis of the semiconductor element string by an angle.

REFERENCES:
patent: 3609475 (1971-09-01), Kaposhilin
patent: 3764862 (1973-11-01), Jankowski
patent: 3914786 (1975-10-01), Grossi
patent: 4032963 (1977-06-01), Thome
patent: 4949156 (1990-08-01), Mii

Affiliated with

Also associated with

Rating

Semiconductor element string structure does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor element string structure, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor element string structure will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-939182