Semiconductor element sealing structure

Details Semiconductor element sealing structure Semiconductor element sealing structure

1987-09-01

1989-03-14

James, Andrew J.

Stock material or miscellaneous articles

Composite

Of bituminous or tarry residue

357 74, 428413, 428447, 525477, 525504, 525131, H01L 2328, H01L 2302, B32B 2738, B32B 904, C08F 800, C08F28300, C08G 828

Patent

active

048128970

ABSTRACT:
A semiconductor element mounted on a substrate is sealed with a silicone gel which has a complex modulus of elasticity such that breakage of solder bumps due to thermal fatique occurs preferentially by shear stress thereto due to a difference between thermal expansion coefficients of the semiconductor element and the substrate, not by tension thereto due to thermal expansion of the silicone gel between the semiconductor element and the substrate.

REFERENCES:
patent: 3906144 (1975-09-01), Wiley
patent: 4159221 (1979-06-01), Schuessler
patent: 4163072 (1979-07-01), Soos
patent: 4190855 (1980-02-01), Inoue
patent: 4558510 (1985-12-01), Tani et al.
patent: 4582762 (1986-04-01), Onohara et al.

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