Stock material or miscellaneous articles – Composite – Of epoxy ether
Patent
1998-06-11
1999-11-16
Gulakkowski, Randy
Stock material or miscellaneous articles
Composite
Of epoxy ether
428418, 438106, 523443, 523466, 524919, 525481, 525523, B32B 2738, H01L 21203, C08L 6300
Patent
active
059854553
ABSTRACT:
Disclosed herein is an epoxy resin compound including an epoxy resin (A), a hardener (B), and an inorganic filler, characterized in that said inorganic filler contains silica (C) as an essential component, said hardener (B) is one which contains at least two phenolic hydroxyl groups and/or naphtholic hydroxyl groups in the molecule, and said silica (C) contains 1-99 wt % of synthetic silica and 99-1 wt % of natural fused silica. Disclosed also herein is a semiconductor device having a semiconductor element sealed therein with said epoxy resin compound. The epoxy resin compound does not cause such troubles as short shot, resin peeling, wire breakage, stage shift, and vent clogging at the time of molding. In addition, when used as a sealing material, it yields semiconductor devices which have good reliability at high temperature and high humidity and good resistance to soldering heat.
REFERENCES:
patent: 4383060 (1983-05-01), Dearlove et al.
patent: 5070154 (1991-12-01), Shiobara et al.
patent: 5306747 (1994-04-01), Ito et al.
patent: 5578660 (1996-11-01), Fujita et al.
Sawamura Yasushi
Tanaka Masayuki
Tokunaga Atsuto
Gulakkowski Randy
Miller Austin R.
Toray Industries Inc.
LandOfFree
Semiconductor element sealed with an epoxy resin compound does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Semiconductor element sealed with an epoxy resin compound, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor element sealed with an epoxy resin compound will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1321999