Semiconductor element protecting compositions

Details Semiconductor element protecting compositions Semiconductor element protecting compositions

1990-08-02

1992-09-01

Michl, Paul R.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Processes of preparing a desired or intentional composition...

523213, 524356, 524366, 524493, 524588, 528 25, 528 38, 528 40, C08K 906

Patent

active

051439484

ABSTRACT:
A polyimide resin is prepared by polymerizing (A) a tetracarboxylic acid dianhydride component consisting essentially of 10 to 50 mol % of 2,2-bis(3,4-benzene-dicarboxylic anhydride)perfluoropropane and 90 to 50 mol % of pyromellitic dianhydride or similar acid dianhydride and (B) a diamine component consisting essentially of 10 to 80 mol % of a silicon diamine and 90 to 20 mol % of an ether diamine. The polyimide resin is dissolved in an organic solvent and blended with finely divided silica to form a composition which is useful for protecting semiconductor elements.

REFERENCES:
patent: 4433131 (1984-02-01), Bolon et al.
patent: 4612361 (1986-09-01), Peters
patent: 4853452 (1989-08-01), Lee
patent: 4864016 (1989-09-01), DuPont et al.
patent: 4997869 (1991-03-01), Eisenbraun et al.
patent: 5041513 (1991-08-01), Okinoshima et al.

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