Semiconductor element mounting method

Details Semiconductor element mounting method Semiconductor element mounting method

1999-04-28

2000-10-17

Nguyen, Tuan H.

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

438118, H01L 2150

Patent

active

061330663

ABSTRACT:
A method of mounting a semiconductor element on a substrate and a semiconductor device formed therewith, includes forming mounting pads on the substrate, roughening a surface of at least one of the pads, positioning a resin between a semiconductor element having electrodes formed thereon and the substrate, and connecting roughened surfaces of the pads to the electrodes, respectively.

REFERENCES:
patent: Re35119 (1995-12-01), Blonder et al.
patent: 4151543 (1979-04-01), Hayakawa et al.
patent: 4786545 (1988-11-01), Sakuma et al.

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