Semiconductor element mounting die pad including a plurality of

Details Semiconductor element mounting die pad including a plurality of Semiconductor element mounting die pad including a plurality of

1992-02-12

1995-03-14

James, Andrew J.

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With structure for mounting semiconductor chip to lead frame

257666, H01L 2348, H01L 2946, H01L 2954, H01L 2962

Patent

active

053979150

ABSTRACT:
A semiconductor element mounting die pad is supported by tie bars. Plural slits and dimples are disposed on a flat surface. The slits are penetrating from the face to the back side of the semiconductor element mounting die pad. Slits are formed, for example, by a punching or chemical etching method. These forming methods are the same as the method of forming the lead frame. Accordingly, if slits are disposed simultaneously when forming the lead frame, the process is not complicated. It is also possible to form these slits using the prior art. Slits of the same shape are formed at an interval of the width of dimples. The rear side is pushed out by press means to form dimples with the boundary of the slits. Thus, slits are formed in one body at both ends of the dimples. By thus composing, the thin type surface mount semiconductor device has a sufficient mechanical strength, and is capable of controlling the stress in a narrow region, so that a semiconductor device of high reliability is realized.

REFERENCES:
patent: 4884124 (1989-11-01), Mori et al.
patent: 5053855 (1991-10-01), Michii et al.
patent: 5126820 (1992-06-01), Brown
patent: 5175610 (1992-12-01), Kobayashi

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