Semiconductor element, method of manufacturing semiconductor...

Details Semiconductor element, method of manufacturing semiconductor... Semiconductor element, method of manufacturing semiconductor...

2008-02-20

2010-12-14

Norris, Jeremy C (Department: 2841)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S762000

Reexamination Certificate

active

07852634

ABSTRACT:
An intermediate layer38is provided on a die pad22of an IC chip20and integrated into a multilayer printed circuit board10. Due to this, it is possible to electrically connect the IC chip20to the multilayer printed circuit board10without using lead members and a sealing resin. Also, by providing the intermediate layer38made of copper on an aluminum pad24, it is possible to prevent a resin residue on the pad24and to improve connection characteristics between the die pad24and a via hole60and reliability.

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