Semiconductor element, method of manufacturing semiconductor...

Details Semiconductor element, method of manufacturing semiconductor... Semiconductor element, method of manufacturing semiconductor...

2001-04-25

2010-12-21

Norris, Jeremy C (Department: 2841)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C361S761000

Reexamination Certificate

active

07855342

ABSTRACT:
A transition layer38is provided on a die pad22of an IC chip20and integrated into a multilayer printed circuit board10.Due to this, it is possible to electrically connect the IC chip20to the multilayer printed circuit board10without using lead members and a sealing resin. Also, by providing the transition layer38made of copper on an aluminum pad24,it is possible to prevent a resin residue on the pad24and to improve connection characteristics between the die pad24and a via hole60and reliability.

REFERENCES:
patent: 3775844 (1973-12-01), Parks
patent: 3903590 (1975-09-01), Yokogawa
patent: 4372996 (1983-02-01), Guditz et al.
patent: 4751146 (1988-06-01), Maeda et al.
patent: 4783695 (1988-11-01), Eichelberger et al.
patent: 5042145 (1991-08-01), Boucquet
patent: 5073814 (1991-12-01), Cole, Jr. et al.
patent: 5081563 (1992-01-01), Feng et al.
patent: 5111278 (1992-05-01), Eichelberger
patent: 5130889 (1992-07-01), Hamburgen et al.
patent: 5161093 (1992-11-01), Gorczyca et al.
patent: 5297006 (1994-03-01), Mizukoshi
patent: 5309322 (1994-05-01), Wagner et al.
patent: 5318923 (1994-06-01), Park
patent: 5353498 (1994-10-01), Fillion et al.
patent: 5386623 (1995-02-01), Okamoto et al.
patent: 5410184 (1995-04-01), Melton et al.
patent: 5434751 (1995-07-01), Cole, Jr. et al.
patent: 5455459 (1995-10-01), Fillion et al.
patent: 5521122 (1996-05-01), Kuramochi
patent: 5563449 (1996-10-01), Dion et al.
patent: 5596227 (1997-01-01), Saito
patent: 5629564 (1997-05-01), Nye, III et al.
patent: 5745984 (1998-05-01), Cole, Jr. et al.
patent: 5773899 (1998-06-01), Zambrano
patent: 5841193 (1998-11-01), Eichelberger
patent: 5887343 (1999-03-01), Salatino et al.
patent: 5940688 (1999-08-01), Higuchi et al.
patent: 5972736 (1999-10-01), Malladi et al.
patent: 5985377 (1999-11-01), Corbett
patent: 5998859 (1999-12-01), Griswold et al.
patent: 6025995 (2000-02-01), Marcinkiewicz
patent: 6110806 (2000-08-01), Pogge
patent: 6111321 (2000-08-01), Agarwala
patent: 6153829 (2000-11-01), Carapella et al.
patent: 6154366 (2000-11-01), Ma et al.
patent: 6162652 (2000-12-01), Dass et al.
patent: 6232558 (2001-05-01), Tsukada et al.
patent: 6248428 (2001-06-01), Asai et al.
patent: 6256875 (2001-07-01), Watanabe et al.
patent: 6281046 (2001-08-01), Lam
patent: 6292366 (2001-09-01), Platt
patent: 6294741 (2001-09-01), Cole, Jr. et al.
patent: 6324067 (2001-11-01), Nishiyama
patent: 6327158 (2001-12-01), Kelkar et al.
patent: 6330259 (2001-12-01), Dahm
patent: 6337228 (2002-01-01), Juskey et al.
patent: 6339197 (2002-01-01), Fushie et al.
patent: 6365833 (2002-04-01), Eng et al.
patent: 6370013 (2002-04-01), Iino et al.
patent: 6395073 (2002-05-01), Dauber
patent: 6433360 (2002-08-01), Dosdos et al.
patent: 6586276 (2003-07-01), Towle et al.
patent: 6627997 (2003-09-01), Eguchi et al.
patent: 6657707 (2003-12-01), Morken et al.
patent: 7189596 (2007-03-01), Mu et al.
patent: 2002/0000239 (2002-01-01), Sachdev et al.
patent: 0 471 938 (1992-02-01), None
patent: 0 777 274 (1997-06-01), None
patent: 0 465 138 (1998-01-01), None
patent: 0 884 128 (1998-12-01), None
patent: 1 003 209 (2000-05-01), None
patent: 1 024 531 (2000-08-01), None
patent: 1 032 030 (2000-08-01), None
patent: 1039789 (2000-09-01), None
patent: 1 259 103 (2002-11-01), None
patent: 02-058345 (1990-02-01), None
patent: 02-312296 (1990-12-01), None
patent: 03-024786 (1991-02-01), None
patent: 03-050734 (1991-03-01), None
patent: 3-77327 (1991-04-01), None
patent: 03-101234 (1991-04-01), None
patent: 04-025038 (1992-01-01), None
patent: 04-65832 (1992-03-01), None
patent: 04-072656 (1992-03-01), None
patent: 05-046069 (1993-06-01), None
patent: 05-275856 (1993-10-01), None
patent: 06-268098 (1994-09-01), None
patent: 6-268101 (1994-09-01), None
patent: 06-350020 (1994-12-01), None
patent: 7-58276 (1995-03-01), None
patent: 08-078572 (1996-03-01), None
patent: 11-163213 (1996-06-01), None
patent: 8-330313 (1996-12-01), None
patent: 09-278494 (1997-10-01), None
patent: 9-321408 (1997-12-01), None
patent: 10-98081 (1998-04-01), None
patent: 10-189635 (1998-07-01), None
patent: 10-199886 (1998-07-01), None
patent: 10-256429 (1998-09-01), None
patent: 10-284632 (1998-10-01), None
patent: 11-054939 (1999-02-01), None
patent: 11-103166 (1999-04-01), None
patent: 11-111738 (1999-04-01), None
patent: 11-126978 (1999-05-01), None
patent: 11-145174 (1999-05-01), None
patent: 11-176977 (1999-07-01), None
patent: 11-233678 (1999-08-01), None
patent: 11-251754 (1999-09-01), None
patent: 11-274734 (1999-10-01), None
patent: 2000-021916 (2000-01-01), None
patent: 2000-150705 (2000-05-01), None
patent: 2000-151079 (2000-05-01), None
patent: 2000-243754 (2000-09-01), None
patent: 2000-260902 (2000-09-01), None
patent: 2000-323645 (2000-11-01), None
patent: 121735 (1997-11-01), None
patent: 1999-002341 (1999-01-01), None
patent: 99-30542 (1999-06-01), None
patent: WO 00/63970 (2000-10-01), None
Michael Gdula, et al., “A High-Speed, High-Density Multiprocessor Module Made with the General Electric High-Density Interconnect Technology” Digital Signal Processing, Academic Press, vol. 2, No. 4, XP-000393639, Oct. 1, 1992, pp. 247-251.
U.S. Office Action dated May 26, 2010, U.S. Appl. No. 12/034,069, 18 pages.

Affiliated with

Also associated with

Rating

Semiconductor element, method of manufacturing semiconductor... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor element, method of manufacturing semiconductor..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor element, method of manufacturing semiconductor... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4217283