Semiconductor element having a carrying device and a lead frame

Valves and valve actuation – Rotary valves – Ball valve

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Details

257666, 257676, 257670, 257690, 257787, 257771, H01L 23495

Patent

active

060361735

ABSTRACT:
A semiconductor component has a semiconductor chip, connection elements, and a housing made of a molding compound. The semiconductor chip has contact pads on a top side. The contact pads are electrically connected to the connection elements via bonding wires. The connection elements overlap the semiconductor chip and they are affixed to the semiconductor chip with an adhesive tape. The adhesive tape has a carrier sheet of aluminum oxide and an adhesive layer applied on both sides of the carrier sheet.

REFERENCES:
patent: 5227232 (1993-07-01), Lim
patent: 5811790 (1998-09-01), Endo et al.

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