Semiconductor element and manufacture thereof

Details Semiconductor element and manufacture thereof Semiconductor element and manufacture thereof

1988-04-22

1993-03-30

Quach, T. N.

Fishing, trapping, and vermin destroying

437 60, 437193, 437200, 437918, 437944, H01L 21266, H01L 21283

Patent

active

051983826

ABSTRACT:
A method of fabricating a polycide semiconductor element in which a lift-off mask is formed on a first region of a layer of polysilicon. A first dopant is implanted into second regions of the polysilicon which are adjacent the first region, the first region being masked from implantation by the lift-off mask. A layer of silicide is forced over the implanted regions and the lift-off mask and then the lift-off mask and the respective part of the layer of silicide which is deposited thereover are removed thereby to expose the first region. The method may be used to fabricate a resistive device in a polycide semiconductor element. There is also disclosed a semiconductor element, e.g. a resistive device, made by the method.

REFERENCES:
patent: 3879236 (1975-04-01), Langdon
patent: 3902926 (1975-09-01), Perloff et al.
patent: 4155778 (1979-05-01), Antipov
patent: 4362597 (1982-12-01), Fraser et al.
patent: 4398341 (1983-08-01), Geipel, Jr. et al.
patent: 4400867 (1983-08-01), Fraser
patent: 4451328 (1984-05-01), Dubois
patent: 4470189 (1984-09-01), Roberts et al.
patent: 4558508 (1985-12-01), Kinney et al.
patent: 4560419 (1985-12-01), Bourassa et al.
patent: 4767721 (1988-08-01), Liao et al.
Abdel, et al, Solid State Electronicsvol. 30, No. 4, 1987, pp. 361-363.

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