Semiconductor electric circuit device with plural-layer aluminum

Details Semiconductor electric circuit device with plural-layer aluminum Semiconductor electric circuit device with plural-layer aluminum

1977-10-13

1979-04-24

James, Andrew J.

357 65, 357 67, 357 59, H01L 2348, H01L 2946, H01L 2954

Patent

active

041515455

ABSTRACT:
A pure aluminum outer layer is provided to facilitate bonding with aluminum bonding wires having a diameter of 50 .mu.m or greater without formation of troublesome slivers upon bonding. Beneath that a copper-bearing aluminum layer with 1 to 4% copper content is provided. A third layer beneath the copper-bearing layer containing up to 1% silicon can be added below the copper-bearing layer to promote adhesion at contact window edges.

REFERENCES:
patent: 3609470 (1971-09-01), Kuiper
patent: 3716469 (1973-02-01), Bhatt et al.
patent: 3740835 (1973-06-01), Duncan
patent: 3830657 (1974-08-01), Farrar
patent: 3863334 (1975-02-01), Coleman
patent: 3879840 (1975-04-01), Ames et al.

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