Semiconductor dynamic sensor and method of manufacturing the...

Details Semiconductor dynamic sensor and method of manufacturing the... Semiconductor dynamic sensor and method of manufacturing the...

2006-12-12

2009-08-11

Huynh, Andy (Department: 2818)

Semiconductor device manufacturing: process

Making device or circuit responsive to nonelectrical signal

C438S049000, C438S050000, C438S051000, C438S052000, C438S053000, C438S106000, C438S108000, C438S109000, C257S414000, C257S417000, C257SE21500, C257SE21513

Reexamination Certificate

active

07572659

ABSTRACT:
A semiconductor sensor includes an adhesive film for suppressing thermal stress transfer to a semiconductor sensor chip. More specifically, the adhesive film includes a first layer and a second layer. An elasticity modulus of the first layer is lower than that of the second layer, and the second layer has a water absorption smaller than that of the first layer. One surface of a semiconductor wafer is in contact with the first layer. Once the semiconductor wafer and the adhesive film are diced into a plurality of sensor chips, the sensor chip with the adhesive film is mounted on a sensor package via the second layer interposed therebetween.

REFERENCES:
patent: 5483106 (1996-01-01), Echigo et al.
patent: 5897337 (1999-04-01), Kata et al.
patent: 6133637 (2000-10-01), Hikita et al.
patent: 6255741 (2001-07-01), Yoshihara et al.
patent: 6323529 (2001-11-01), Nagahara
patent: 6448624 (2002-09-01), Ishio et al.
patent: 6810736 (2004-11-01), Ikezawa et al.
patent: 2001/0055836 (2001-12-01), Kunda
Office Action dated Jul. 1, 2008 in corresponding DE application No. 102006058325.6 (and English Translation).

Affiliated with

Also associated with

Rating

Semiconductor dynamic sensor and method of manufacturing the... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor dynamic sensor and method of manufacturing the..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor dynamic sensor and method of manufacturing the... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4082500