Semiconductor diode device with non-planar heatsink and method o

Details Semiconductor diode device with non-planar heatsink and method o Semiconductor diode device with non-planar heatsink and method o

1995-12-18

1998-05-12

Tran, Minh-Loan

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

257719, 257727, 257796, H01L 2334

Patent

active

057510610

ABSTRACT:
A semiconductor diode device (10) includes two heatsinks (11, 12), a semiconductor substrate (15) having a p-n junction (35) and located between the two heatsinks (11, 12), solder (13, 14) between the heatsinks (11, 12) and the semiconductor substrate (15), and a packaging material (16) covering the semiconductor substrate (15), the solder (13, 14), and a portion of the two heatsinks (11, 12). The two heatsinks (11, 12) each have a curved surface (21, 22), which reduces tilting of the semiconductor substrate (15), reduces temperature gradients across surfaces (23, 24) of the semiconductor substrate (15), and improves the reliability of the semiconductor diode device (10). The two heatsinks (11, 12) also include protrusions (19, 20), which help to keep the packaging material (16) covering the curved surfaces (21, 22) of the heatsinks (11, 12).

REFERENCES:
patent: 3996602 (1976-12-01), Goldberg et al.
patent: 4093958 (1978-06-01), Riccio, Jr.
patent: 4759829 (1988-07-01), Fuccello, Sr. et al.
patent: 4935803 (1990-06-01), Kalfus et al.
patent: 5081067 (1992-01-01), Shimizu et al.
patent: 5172755 (1992-12-01), Samarov

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