Electricity: measuring and testing – Measuring – testing – or sensing electricity – per se – With rotor
Patent
1990-08-16
1991-10-22
Weider, Kenneth A.
Electricity: measuring and testing
Measuring, testing, or sensing electricity, per se
With rotor
324 731, 371 251, 437 8, E01R 3128
Patent
active
050598996
ABSTRACT:
Disclosed is a method for producing individual semiconductor chips which are singulated from larger wafers, and singulated wafers produced according to the method. Wafers from which the singulated dies are produced include scribe line area through which the wafer is cut by a saw or other method for singulating individual dies. In one aspect of the invention, test pads are provided within the scribe line area for testing of individual dies prior to severing of the wafer. In another aspect of the invention, conventional test circuitry is formed within the scribe line area and utilized in conjunction with text pads for testing operability of individual wafers prior to severing of the wafer into individual chips. Upon test, the scribe lines are severed effectively destroying the sacrificial test pads and circuitry.
REFERENCES:
patent: 3781683 (1973-12-01), Freed
patent: 4458297 (1984-07-01), Stopper et al.
patent: 4467400 (1984-08-01), Stopper
patent: 4479088 (1984-10-01), Stopper
patent: 4752929 (1988-06-01), Kantz et al.
patent: 4812742 (1989-03-01), Abel et al.
patent: 4918379 (1990-04-01), Jongepier
patent: 4961053 (1990-10-01), Krug
patent: 4970454 (1990-11-01), Stambaugh et al.
Duesman Kevin
Farnworth Warren D.
Heitzeberg Ed
Micro)n Technology, Inc.
Nguyen Vinh P.
Weider Kenneth A.
LandOfFree
Semiconductor dies and wafers and methods for making does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Semiconductor dies and wafers and methods for making, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor dies and wafers and methods for making will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-111040