Semiconductor die with protective layer and related method...

Details Semiconductor die with protective layer and related method... Semiconductor die with protective layer and related method...

2007-10-09

2007-10-09

Ho, Tu-Tu (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Physical configuration of semiconductor

With peripheral feature due to separation of smaller...

C257SE21523

Reexamination Certificate

active

11235320

ABSTRACT:
A semiconductor die and a related method of processing a semiconductor wafer are disclosed in which a first interlayer insulator having a recess region of varying configuration and defining a scribe line is associated with at least one protective layer formed with a characterizing inclined side surface.

REFERENCES:
patent: 6538301 (2003-03-01), Yamada et al.
patent: 6566735 (2003-05-01), Minn et al.
patent: 00122737 (1983-07-01), None
patent: 00264489 (1996-10-01), None

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