Semiconductor die with mask programmable interface selection

Details Semiconductor die with mask programmable interface selection Semiconductor die with mask programmable interface selection

2011-07-19

2011-07-19

Nguyen, Cuong Q (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

C257S686000, C257S777000, C257SE25013, C455S070000

Reexamination Certificate

active

07982294

ABSTRACT:
According to one exemplary embodiment, a semiconductor die with on-die preferred interface selection includes at least two groups of pads situated on an active surface of the semiconductor die, where each of the at least two groups of pads is coupled to its associated interface in the die. A set of bumps is mask-programmably routed to one of the at least two groups of pads, thereby selecting the preferred interface for the semiconductor die. A non-preferred interface is not routed to any bumps on the active surface of the semiconductor die, thereby reducing bump count on the die. Each of the at least two groups of pads can be situated in a corresponding pad ring on the active surface of said semiconductor die. The at least two groups of pads can be laid out substantially inline.

REFERENCES:
patent: 6420781 (2002-07-01), Wendorff et al.
patent: 2008/0090527 (2008-04-01), Atkinson et al.

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