Semiconductor die with heat and electrical pipes

Details Semiconductor die with heat and electrical pipes Semiconductor die with heat and electrical pipes

2006-07-11

2006-07-11

Nelms, David (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Field effect device

Junction field effect transistor

C257S069000, C257S350000, C438S122000

Reexamination Certificate

active

07075133

ABSTRACT:
Thermal hot spots in the substrate of a semiconductor die, and the required surface area of the semiconductor die, are substantially reduced by forming thermal or thermal and electrical pipes in the substrate that extend from a bottom surface of the substrate to a point near the top surface of the substrate.

REFERENCES:
patent: 6249136 (2001-06-01), Maley
patent: 6677235 (2004-01-01), Yegnashankaran et al.
patent: 2004/0152240 (2004-08-01), Dangelo

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