Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Reexamination Certificate
2008-01-09
2010-11-02
Andújar, Leonardo (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
With structure for mounting semiconductor chip to lead frame
C257S686000, C257S772000, C257S777000, C257S779000
Reexamination Certificate
active
07825502
ABSTRACT:
Disclosed are semiconductor die packages having overlapping dice, systems that use such packages, and methods of making such packages. An exemplary die package comprises a leadframe, a first semiconductor die, and a second semiconductor die that has a recessed portion in one of its surfaces. The first die is disposed over a first portion of the leadframe, and the second die is disposed over a second portion of the leadframe with its recess portion overlying at least a portion of the first die. Another exemplary die package comprises a leadframe with a recessed area, a first semiconductor die disposed in the recessed area, and a second semiconductor die overlying at least a portion of the first die. Preferably, electrically conductive regions of both dice are electrically coupled to a conductive region of the leadframe to provide an interconnection between dice that has very low parasitic capacitance and inductance.
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U.S. Appl. No. 11/857,199, Liu et al.
Irving Scott
Liu Yong
Qian Qiuxiao
Andújar Leonardo
Arroyo Teresa M
Fairchild Semiconductor Corporation
Townsend and Townsend / and Crew LLP
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