Semiconductor die packages having lead support frame

Details Semiconductor die packages having lead support frame Semiconductor die packages having lead support frame

1992-07-09

1994-02-15

Hearn, Brian E.

Fishing, trapping, and vermin destroying

437209, 437214, 437217, 437220, H01L 2160

Patent

active

052866807

ABSTRACT:
A process for forming a lead pack including a frame of electrical insulating material with a plurality of spaced embedded leads extending inwardly and outwardly from said frame. Additionaly connecting the inwardly extending leads to the contact pads of a semiconductor device and the outwardly extending leads to a transport tape for testing.

REFERENCES:
patent: 4063993 (1977-12-01), Burns
patent: 4259436 (1981-03-01), Tabuchi et al.
patent: 4733292 (1988-03-01), Jarvis
patent: 4743956 (1988-05-01), Olla et al.
patent: 4859632 (1989-08-01), Lumbard
patent: 5057461 (1991-10-01), Fritz

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