Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With dam or vent for encapsulant
Reexamination Certificate
2007-01-16
2007-01-16
Le, Thao X. (Department: 2814)
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
With dam or vent for encapsulant
C257S675000, C257SE23037
Reexamination Certificate
active
10364549
ABSTRACT:
In one exemplary embodiment, a structure comprises a substrate having a top surface, and a die attach pad situated on the top surface of the substrate. The die attach pad includes a die attach region and at least one substrate ground pad region electrically connected to the die attach region. The die attach pad further includes a die attach stop between the die attach region and the at least one substrate ground pad region. The die attach stop acts to control and limit die attach adhesive flow out to the at least one substrate ground pad region during packaging so that the at least one substrate ground pad region can be moved closer to die attach region so that shorter bond wires for connecting the at least one substrate ground pad region to a die wire bond pad may be used during packaging.
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Petty-Weeks Sandra L.
Welch Patrick L.
Farjami & Farjami LLP
Le Thao X.
Skyworks Solutions Inc.
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