Semiconductor die package with internal bypass capacitors

Details Semiconductor die package with internal bypass capacitors Semiconductor die package with internal bypass capacitors

2005-07-08

2008-11-04

Chu, Chris C. (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Integrated circuit structure with electrically isolated...

Passive components in ics

C257SE23079, C257S528000, C257S691000, C257S723000, C361S782000

Reexamination Certificate

active

07446389

ABSTRACT:
One embodiment of the present invention provides an apparatus that reduces voltage noise for an integrated circuit (IC) device. This apparatus includes a package which is configured to be sandwiched between the IC device and a circuit board. This package has a bottom surface, which is configured to receive electrical connections for power, ground and other signals from the circuit board, and a top surface, which is configured to provide electrical connections for power, ground and the other signals to the IC device. A plurality of bypass capacitors are integrated into the package and are coupled between the power and ground connections for the IC device, so that the plurality of bypass capacitors reduce voltage noise between the power and ground connections for the IC device.

REFERENCES:
patent: 5939783 (1999-08-01), Laine et al.
patent: 6346743 (2002-02-01), Figueroa et al.
patent: 6407929 (2002-06-01), Hale et al.
patent: 6970362 (2005-11-01), Chakravorty
patent: 7132743 (2006-11-01), Palanduz
patent: 2003/0102555 (2003-06-01), Patel et al.

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