Semiconductor die package using leadframe and clip and...

Details Semiconductor die package using leadframe and clip and... Semiconductor die package using leadframe and clip and...

2007-09-17

2011-11-15

Mitchell, James (Department: 2813)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

C257S666000, C257S667000

Reexamination Certificate

active

08058107

ABSTRACT:
A clip structure for a semiconductor package is disclosed. The clip structure includes a major portion, at least one pedestal extending from the major portion, a downset portion, and a lead portion. The downset portion is between the lead portion and the major portion. The clip structure can be used in a MLP (micro-leadframe package).

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Office Action dated Feb. 1, 2011 to Japanese Patent Application No. 2008-541187 in English language, 4 pages.

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