Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate
2007-10-23
2007-10-23
Potter, Roy Karl (Department: 2822)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With contact or lead
C257S692000
Reexamination Certificate
active
11282967
ABSTRACT:
A clip structure for a semiconductor package is disclosed. The clip structure includes a major portion, at least one pedestal extending from the major portion, a downset portion, and a lead portion. The downset portion is between the lead portion and the major portion. The clip structure can be used in a MLP (micro-leadframe package).
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Cabahug Elsie
Cruz Erwin Victor R.
Iyer Venkat
Shian Ti Ching
Fairchild Semiconductor Corporation
Potter Roy Karl
Townsend and Townsend / and Crew LLP
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