Semiconductor die package including multiple dies and a...

Details Semiconductor die package including multiple dies and a... Semiconductor die package including multiple dies and a...

2006-04-24

2009-11-17

Maldonado, Julio J. (Department: 2823)

Semiconductor device manufacturing: process

Chemical etching

Vapor phase etching

C257S724000, C257S726000, C257S727000, C257S730000, C257SE23143, C257SE23151

Reexamination Certificate

active

07618896

ABSTRACT:
A semiconductor die package capable of being mounted to a motherboard is disclosed. The semiconductor die package includes a substrate, and a first semiconductor die mounted on the substrate, where the first semiconductor die includes a first vertical device comprising a first input region and a first output region at opposite surfaces of the first semiconductor die. The semiconductor die package includes a second semiconductor die mounted on the substrate, where second semiconductor die comprises a second vertical device comprising a second input region and a second output region at opposite surfaces of the second semiconductor die. A substantially planar conductive node clip electrically communicates the first output region in the first semiconductor die and the second input region in the second semiconductor die. The first semiconductor die and the second semiconductor die are between the substrate and the conductive node clip.

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