Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package
Reexamination Certificate
2011-03-29
2011-03-29
Dickey, Thomas L (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
C257S666000
Reexamination Certificate
active
07915721
ABSTRACT:
A semiconductor die package. Embodiments of the semiconductor die package are usable in backlight circuitry. Systems in packages may include a bridge circuit or a part thereof, and a integrated circuit die, such as a driver die, encapsulated by a molding material or other package. The bridge circuit may be stacked on opposing surfaces of a leadframe.
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Liu Yong
Qian Qiuxiao
Zhang Jiangyuan
Dickey Thomas L
Fairchild Semiconductor Corporation
Kilpatrick Townsend & Stockton LLP
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