Semiconductor die package including IC driver and bridge

Details Semiconductor die package including IC driver and bridge Semiconductor die package including IC driver and bridge

2011-03-29

2011-03-29

Dickey, Thomas L (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

C257S666000

Reexamination Certificate

active

07915721

ABSTRACT:
A semiconductor die package. Embodiments of the semiconductor die package are usable in backlight circuitry. Systems in packages may include a bridge circuit or a part thereof, and a integrated circuit die, such as a driver die, encapsulated by a molding material or other package. The bridge circuit may be stacked on opposing surfaces of a leadframe.

REFERENCES:
patent: 4390771 (1983-06-01), Kurtz et al.
patent: 4476366 (1984-10-01), Kurtz et al.
patent: 4482794 (1984-11-01), Kurtz et al.
patent: 4680613 (1987-07-01), Daniels et al.
patent: 4933743 (1990-06-01), Thomas et al.
patent: 5000818 (1991-03-01), Thomas et al.
patent: 5072275 (1991-12-01), Vora
patent: 5117276 (1992-05-01), Thomas et al.
patent: 5340762 (1994-08-01), Vora
patent: 6893901 (2005-05-01), Madrid
patent: 7023077 (2006-04-01), Madrid
patent: 7057907 (2006-06-01), Oh
patent: 7205724 (2007-04-01), Ahn et al.
patent: 7285849 (2007-10-01), Cruz et al.
patent: 7317444 (2008-01-01), Chang
patent: 7457140 (2008-11-01), Klein
patent: 7531966 (2009-05-01), Hwang et al.
patent: 2005/0218825 (2005-10-01), Chiou
patent: 2005/0224945 (2005-10-01), Saito et al.
patent: 2007/0215996 (2007-09-01), Otremba
patent: 2007/0262346 (2007-11-01), Otremba et al.
patent: 2008/0061396 (2008-03-01), Havanur
patent: 2009/0108467 (2009-04-01), Otremba
Datasheet for Fairchild Semiconductor LCD Backlight Inverter Drive Integrated Circuit, FAN7310, May 2007, pp. 1-11.
Notification of Transmittal of the International Search Report and The Written Opinion of the International Searching Authority , or the Declaration from International Application No. PCT/US2009/036290 dated Sep. 3, 2009, 13 pages.

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