Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Outside periphery of package having specified shape or...
Patent
1998-03-03
2000-06-20
Hardy, David
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Outside periphery of package having specified shape or...
257693, H01L 2304
Patent
active
060781025
ABSTRACT:
A semiconductor die package includes a housing and a plurality of leads extending through openings in the housing. The package is designed to be mounted to a printed circuit board in both a horizontal configuration and in an upright configuration. In the horizontal configuration, the face of the die is held parallel to the surface of the printed circuit board. An edge of the die faces the printed circuit board when the package is mounted in an upright configuration. The leads are L-shaped so that either an end surface or an outer side surface of the lead can be surface mounted to the printed circuit board. The leads may extend from only one side wall of the housing. In this case, the housing may include a standoff on a bottom surface adjacent a side wall opposite the leads to balance the housing. Alternatively, stabilizing leads may be provided from the opposite side wall to improve horizontal mounting stability. To improve upright mounting stability, the leads may extend from the one side of the housing in two rows. The housing may be L-shaped to increase the separation between the two rows of leads. The semiconductor die package may house a sensor die or both a sensor die and a controller die.
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Crane, Jr. Stanford W.
Krishnapura Lakshminarasimha
Hardy David
Silicon Bandwidth Inc.
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