Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Wire contact – lead – or bond
Reexamination Certificate
2005-06-07
2005-06-07
Clark, S. V. (Department: 2815)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Wire contact, lead, or bond
C257S783000, C438S118000
Reexamination Certificate
active
06903464
ABSTRACT:
Semiconductor die assemblies, die packages, methods for fabricating the semiconductor die assemblies and packages, and systems incorporating the die packages are provided. The die assembly construction allows for a ball grid array to extend beyond the width of a semiconductor die and increase the capacity for external contacts while maintaining the size of the assembly and package to correspond to the lengthwise dimension of the die.
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Clark S. V.
Micro)n Technology, Inc.
Whyte Hirschboeck Dudek SC
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