Semiconductor die carrier having a dielectric epoxy between adja

Details Semiconductor die carrier having a dielectric epoxy between adja Semiconductor die carrier having a dielectric epoxy between adja

1997-07-29

1998-10-13

Kincaid, Kristine L.

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

257678, 361772, H01L 2302

Patent

active

058214577

ABSTRACT:
A semiconductor die carrier includes an insulative module; a plurality of electrically conductive leads extending from the insulative module; a semiconductor die housed with the insulative module; and at least one high frequency capacitor secured to the insulative module for facilitating transmission of high frequency signals carried to and from the semiconductor die on the electrically conductive leads.

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