Semiconductor die bonding machine

Details Semiconductor die bonding machine Semiconductor die bonding machine

1981-02-23

1983-10-04

Godici, Nicholas P.

Metal fusion bonding

With means to juxtapose and bond plural workpieces

Plural discrete workpieces

B23K 112

Patent

active

044074409

ABSTRACT:
A semiconductor die bonding machine for the electrical connection of the contact pads of a semiconductor die with the leads of a die holding device, such as a printed circuit board or main leadframe. The bonding machine utilizes micro leadframes formed in an aluminum foil tape and has an alignment mechanism which permits the rapid, mechanized bonding of the contact pads to the leads of the die holding device.

REFERENCES:
patent: 2990732 (1961-07-01), Ide
patent: 3781978 (1974-01-01), Intrator et al.
patent: 3949925 (1976-04-01), Keizer et al.
patent: 4079509 (1978-03-01), Jackson et al.

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