Adhesive bonding and miscellaneous chemical manufacture – Surface bonding means and/or assembly means therefor – With work feeding or handling means
Reexamination Certificate
2011-03-01
2011-03-01
Nguyen, Khanh (Department: 1746)
Adhesive bonding and miscellaneous chemical manufacture
Surface bonding means and/or assembly means therefor
With work feeding or handling means
C156S511000, C156S518000, C156S521000, C156S538000, C156S499000, C156S556000, C228S006100, C228S004100, C228S049100
Reexamination Certificate
active
07896051
ABSTRACT:
A die bonding apparatus is presented which is capable of realizing different semiconductor packages, for example, a face up package and a face down package in a single die bonding apparatus. The die bonding apparatus includes a substrate transportation unit for transporting a substrate. A first bonding head unit is included which has a first bonding head for bonding a semiconductor chip disposed in a mount table adjacent to the substrate transportation unit over the substrate. A die transportation unit is included for transporting the semiconductor chip disposed in a mount table to a mount stage disposed at a lower portion of the substrate. A second bonding head unit is included in which the mount stage and a second bonding head disposed at an upper portion of the substrate corresponding to the mount stage and bonding the semiconductor chip disposed in the mount stage to the lower portion of the substrate.
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Kang Byung Chul
Koh Kwang Duck
Lee Hwa Seob
Lee Jum Dong
Shin Jae Moo
Aziz Keith T
Hynix / Semiconductor Inc.
Ladas & Parry LLP
Nguyen Khanh
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