Semiconductor die attachment for high vacuum tubes

Details Semiconductor die attachment for high vacuum tubes Semiconductor die attachment for high vacuum tubes

2005-07-28

2009-10-27

Ward, Jessica L (Department: 1793)

Metal fusion bonding

Tube end closing

C257S700000, C257S687000

Reexamination Certificate

active

07607560

ABSTRACT:
Bonding and interconnect techniques including a spacer for use with semiconductor die for the creation of thermally efficient, physically compliant Ultra High Vacuum Tubes and the tube resulting therefrom.

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