Semiconductor die attachment for high vacuum tubes

Details Semiconductor die attachment for high vacuum tubes Semiconductor die attachment for high vacuum tubes

2006-03-14

2006-03-14

Dang, Phuc T. (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Housing or package filled with solid or liquid electrically...

C257S730000

Reexamination Certificate

active

07012328

ABSTRACT:
There is described novel bonding and interconnecting techniques for use with semiconductor die for the creation of thermally efficient, physically compliant Ultra High Vacuum Tubes and the novel tube resulting therefrom.

REFERENCES:
patent: 4687922 (1987-08-01), Lemonier et al.
patent: 6020646 (2000-02-01), Boyle et al.
patent: 6281572 (2001-08-01), Robbins
patent: 6285018 (2001-09-01), Aebi et al.
patent: 6507147 (2003-01-01), Costello
patent: 6614110 (2003-09-01), Pace
patent: 6656768 (2003-12-01), Thomas
patent: 6747258 (2004-06-01), Benz et al.
Kyocera's “Multilayer Ceramics Design Guide”, 1995 CAT/2T9504THA/1244E.

Affiliated with

Also associated with

Rating

Semiconductor die attachment for high vacuum tubes does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor die attachment for high vacuum tubes, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor die attachment for high vacuum tubes will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3555197