Semiconductor die and mounting assembly

Details Semiconductor die and mounting assembly Semiconductor die and mounting assembly

1987-05-18

1991-04-30

Mintel, William

357 81, 357 54, 357 49, H01L 2328

Patent

active

050123220

ABSTRACT:
A uniformly thick dielectric polyimide coating is provided on the back face of an integrated circuit and the die is mounted to a copper lead frame finger by interposing an epoxy resin bonding agent between the uniformly thick polyimide coating and the copper support finger. The die coating is provided before separating die from the precursive water. Liquid polyimide is poured onto the back side of the water which is spun, in a manner similar to that usually used for obtaining uniformly thick photoresist films. After curing the polyimide, the die are cut from the wafer by sawing.

REFERENCES:
patent: 3568012 (1971-03-01), Ernst et al.
patent: 3691628 (1972-09-01), Kim et al.
patent: 4136352 (1979-01-01), Moutou et al.
patent: 4268848 (1981-05-01), Casey et al.
patent: 4278990 (1981-07-01), Fichot
patent: 4330790 (1982-05-01), Burns
patent: 4450471 (1984-05-01), Wellhoefer et al.
patent: 4510519 (1985-04-01), Dubois et al.
patent: 4667214 (1987-05-01), Sekimura et al.

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