Semiconductor diaphragm pressure sensor with grooves to absorb a

Details Semiconductor diaphragm pressure sensor with grooves to absorb a Semiconductor diaphragm pressure sensor with grooves to absorb a

1995-12-28

1997-06-10

Chilcot, Richard

Measuring and testing

Fluid pressure gauge

Diaphragm

73717, 73723, 29740, G01L 708, G01L 900

Patent

active

056378017

ABSTRACT:
A semiconductor pressure sensor includes a pressure sensor chip including a diaphragm at the center thereof for measuring pressure and a die with an opening for introducing the pressure to the diaphragm. The pressure sensor chip is fixed to the die using an adhesive agent. Furthermore, prevention grooves are formed on the surface of the pressure sensor chip to prevent the adhesive agent from elevating onto the diaphragm.

REFERENCES:
patent: 4787250 (1988-11-01), Varrese

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