Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Patent
1996-02-23
1997-03-11
Crane, Sara W.
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With provision for cooling the housing or its contents
257684, 257690, 361760, H01L 2334
Patent
active
056104405
ABSTRACT:
In a semiconductor device comprising a semiconductor chip, a heat radiation plate mounting the semiconductor chip thereon and having a plurality of rounded corner portions of a first radius, a ceramic substrate for mounting the heat radiation plate, and a metallize pattern formed onto the ceramic substrate for soldering the heat radiation plate onto the ceramic substrate, the metallize pattern has a plurality of rounded corner portions of a second radius. The metallize pattern is larger than the heat radiation plate in area. The first radius is greater than the second radius.
REFERENCES:
patent: 5150198 (1992-09-01), Ohikata et al.
patent: 5388029 (1995-02-01), Moriyama
Japanese Patent Application 63-172449.
Crane Sara W.
NEC Corporation
Wille Douglas
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