Semiconductor devices with means to reduce contamination

Details Semiconductor devices with means to reduce contamination Semiconductor devices with means to reduce contamination

1998-02-25

2000-11-21

Thomas, Tom

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Ball or nail head type contact, lead, or bond

257780, 257725, 257773, H01L 2348, H01L 2352, H01L 2940

Patent

active

061507253

ABSTRACT:
An enclosure is formed on a substrate of a semiconductor device surrounding a bonding pad, such that a groove is formed between the enclosure and the bonding pad. An insulating film is formed over the substrate, including the enclosure and the groove. The groove and the film prevent moisture and contaminants from seeping into the semiconductor device.

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